Quote in 15 min·24/7 × 365AS9120:2025 · ISO 9001:2015 · FAA AC 00-56B

2296BG

Boyd 2296bg - 17.65mm Height, 31.75mm Length, 31.75mm Width - Bond-On Heat Sink For Leadless Chip Carriers And Flat Packs. Primarily Designed For 68-Position Devices.

Boyd 2296bg - 17.65mm Height, 31.75mm Length, 31.75mm Width - Bond-On Heat Sink For Leadless Chip Carriers And Flat Packs. Primarily Designed For 68-Position Devices. ASAP can help source this line with documentation review, alternate part checks, condition requirements, and account manager follow-up for urgent or planned procurement.

Boyd (formerly Aavid)

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Detailed description

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Cross references

Unrestricted

Export control

N/A

FSC

Why ASAP

Operations-grade aviation sourcing.

AS9120B

Quality-managed distribution

15 min

Average RFQ response, 24/7

Full trace

Documentation & certs on request

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Request a quote for 2296BG

Send this part to ASAP with quantity, need-by timing, and buyer contact details. An account manager will review availability, alternates, certificates, and delivery options.

Part-specific RFQ

Submit RFQ for 2296BG

Send this part to ASAP with quantity, need-by timing, and buyer contact details. A dedicated account manager reviews availability, alternates, certificates, and delivery options.

Boyd 2296bg - 17.65mm Height, 31.75mm Length, 31.75mm Width - Bond-On Heat Sink For Leadless Chip Carriers And Flat Packs. Primarily Designed For 68-Position Devices.2296BG

Manufacturer: Boyd (formerly Aavid)