Submit a Quote for Part JBP18S03XMFD by Texas Instruments Incorporated with NSN 5962-01-326-4310
Part Number : JBP18S03XMFD
Manufacturer : Texas Instruments Incorporated
NSN : 5962-01-326-4310
NIIN : 013264310
Item Name : Microcircuit Memory
CAGE Code : 01295
Part number JBP18S03XMFD is now available in our ready-to-ship NSN parts inventory. The unique NSN for this part is 5962013264310. This part is manufactured by Texas Instruments Incorporated. Would you like to receive a quick quote for the part having description as Microcircuit Memory and Cage Code as 01295 ? Fill out the form to get started. All fields marked with an asterisk (*) must be carefully and completely filled out. Please make sure that you enter Need Parts By and Quantity (ea) correctly before submitting the form as they determine the bulk of your quote. One of our experts will respond within 15 minutes on the basis of answers entered in these fields. Accelerating RFQs is owned and operated by ASAP Semiconductor, one of the industry’s top supplier of JBP18S03XMFD by Texas Instruments Incorporated. With more than 2 billion NSNs from 26 distinct federal supply codes.
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NSN Information for Part Number JBP18S03XMFD with NSN 5962-01-326-4310, 5962013264310
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-326-4310 Item Description: Microcircuit Memory | 5962 | 013264310 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Jbp18s03xmfd | 2 | 9 | 5 |
Characteristics Data of NSN 5962-01-326-4310, 5962013264310
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.080 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 1260-01-208-6448 MAST MOUNTED SI |
CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND ELECTROSTATIC SENSITIVE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
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